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Quectel expands antenna portfolio with two models tailored for ISM devices

ISM devices

ISM devices – Quectel Wireless Solutions, a global IoT solutions provider, is pleased to announce the launch of two new high performance ISM antennas, the YENT001W1AM and YENT002W1AM, designed to meet the need for wireless communication in devices that operate through the industrial, scientific, and medical (ISM) bands. These frequency bands are internationally reserved for unlicensed use, and they support a wide range of applications.

The YENT001W1AM is an ISM external antenna measuring 135mm× 15.6mm × 13mm. This low profile, terminal mount omnidirectional antenna provides broad coverage from 410–470MHz. It is terminated with an SMA male connector and is designed as a monopole antenna, which needs to be mounted on a ground plane to offer high efficiency in all working bands.

The YENT002W1AM is an ISM external antenna that shares the same dimensions as the YENT001W1AM. This ultra-wideband ISM antenna provides broad coverage from 850–950MHz. The antenna is terminated with a hinged RP SMA male connector and is also well-suited to discreet deployment. The YENT002W1AM is designed as dipole type antenna to work with various ground plane sizes or in free space for ease of integration.

“It’s great to bring further choice to the ISM antenna market with the YENT001W1AM and YENT002W1AM antennas,” commented David Wei, Senior Product Director, Antenna Product Dept, Quectel Wireless Solutions. “The growing number of applications in the ISM device market extends across wireless data transmission, automated manufacturing, safety alerts and industrial IoT. In these scenarios, developers and designers need the opportunity to optimize performance and antennas play a critical role here. Customers can also take advantage of Quectel’s full range of engineering and support services to make the most of their antenna deployments.”

Both antennas feature durable PC and ABS enclosures for maximized durability and are compatible with Quectel’s ISM series of modules. These antennas are suitable for applications such as safety alerts, wireless data transmission, automated manufacturing and for deployment in many other IoT devices.

In addition to supplying antennas, Quectel also offers comprehensive antenna design support which includes simulation, testing and manufacturing for customized antenna solutions. These can be custom designed to ensure the antenna deployment scenario aligns precisely with the developers’ specific application requirements. Quectel’s regional R&D centers, coupled with its global network of antenna experts, are ready to help meet the requirements of device designers, developers and deployment specialists as they roll-out 5G-capable antennas to their customers.

Utah Scientific Releases NBOSS Software-Based NMOS Control Solution for Hybrid SDI/IP Workflows

NBOSS Software-Based NMOS Control Solution – Utah Scientific today announced NBOSS, a new software-based control solution designed to streamline the management of NMOS-compliant devices in hybrid SDI/IP environments. Designed for use in broadcast, production, post-production, and pro-AV settings, NBOSS enhances workflow efficiency and reduces operational costs, empowering facilities to build hybrid SDI/IP infrastructures with greater ease and reliability while also expanding the utility of Utah Scientific’s existing hardware.

The company’s latest innovation in control systems, NBOSS addresses customer demand for a more integrated and cost-effective way to manage Utah Scientific’s expanding product line, particularly the PassThrough Card and OnRamp devices. It allows users to control NMOS devices directly from Utah Scientific’s SC4 Control System using a variety of interfaces, including hardware panels, Soft-LC panels, and Web-Panel. This marks a significant step forward in simplifying IP integration for facilities that rely on Utah Scientific’s Series 2 routers. By offering native control functionality, NBOSS eliminates the need for expensive third-party broadcast controllers, which often fall short of meeting specific customer requirements.

Because of Utah Scientific’s unique 10-year hardware warranty on routers, NBOSS can expand an existing Utah Scientific installation with future-proof hardware and software or can be purchased as part of a new system. It includes a full NMOS ecosystem that enables device inventory gathering via IS-04, configuration within the Ucon/SC4 system, and control of signal connections to NMOS-compliant devices. This includes support for one video flow, two audio flows, and one ancillary flow, providing a robust and flexible solution for modern broadcast and production environments. It makes switching 2110 signals as easy as switching SDI.

“With NBOSS, we’re giving our customers a smarter, more streamlined way to manage NMOS devices within their new or existing Utah Scientific infrastructure,” said Brett Benson, CEO of Utah Scientific. “NBOSS simplifies hybrid workflows, reduces reliance on third-party systems, and makes our Series 2 routers and OnRamp devices even more versatile. This isn’t just a new control tool — it’s a foundational step toward full IP domain integration.”

Utah Scientific will unveil NBOSS at IBC in Amsterdam, Sept. 12-15. NBOSS will be available in Q4 2025, with pricing dependent on customer build requirements.

More information about Utah Scientific and the company’s product line is available at www.utahscientific.com.

How Electrodeposited Copper Foils Market is Powering EV Batteries and Electronics?

Electrodeposited Copper Foils Market

The modern world is being reshaped by rapid technological advancements, with the electric vehicle (EV) revolution and the booming electronics sector standing at the forefront. At the core of these industries lies a material that is not always discussed outside of technical circles, but whose importance is unmatched — electrodeposited copper foils. As the demand for efficient, sustainable, and high-performing energy storage grows, the Electrodeposited Copper Foils Market has emerged as a critical enabler of transformation across industries.

This blog explores how electrodeposited copper foils are driving innovations in EV batteries and electronics, their market growth trajectory, and what the future holds.

The Rising Importance of Electrodeposited Copper Foils

Electrodeposited copper foils (ED copper foils) are ultra-thin sheets of copper produced through an electrolysis process. They possess excellent conductivity, adhesion, and mechanical strength, making them indispensable in applications such as lithium-ion batteries, printed circuit boards (PCBs), and other high-performance electronics.

As global industries push for miniaturization, energy efficiency, and high-capacity storage, ED copper foils are finding increased applications. This surge in usage is shaping not just technological progress but also the financial outlook of the Electrodeposited Copper Foils Market, which is on a steady growth trajectory worldwide.

Driving the Electric Vehicle Revolution

The electrification of transportation has shifted into overdrive, with governments, consumers, and manufacturers aligning toward sustainable mobility. Lithium-ion batteries are the heart of EVs, and electrodeposited copper foils are one of their most vital components.

Copper foils serve as the current collector in lithium-ion batteries, ensuring seamless electron flow between electrodes. With EVs requiring large-scale, high-capacity batteries, the demand for high-quality foils has surged exponentially. Innovations in battery energy density and the push for longer driving ranges continue to fuel the dependency on ED copper foils.

Automakers are investing billions into gigafactories worldwide, amplifying the need for copper foils. For instance, Asia Pacific — particularly China, South Korea, and Japan — dominates global EV battery production, and consequently holds a substantial share of the Electrodeposited Copper Foils Market.

Transforming the Electronics and PCB Industry

Beyond EVs, the role of electrodeposited copper foils in electronics is just as transformative. The electronics industry thrives on miniaturization, precision, and durability — and copper foils provide exactly that.

Printed Circuit Boards (PCBs): ED copper foils are extensively used in multilayer PCBs, which are essential for consumer electronics, industrial automation, and telecommunications equipment.

High-Frequency Devices: With the rise of 5G networks, the demand for foils that can support high-frequency transmission with minimal loss has grown.

Wearable Technology: Lightweight, flexible, and durable foils enable the production of wearable devices, an industry experiencing rapid adoption globally.

The growing reliance on smart devices, IoT, and high-performance computing ensures that copper foils remain the backbone of innovation in this sector.

Key Market Growth Drivers

Several factors are accelerating the expansion of the global market:

Booming EV Sales: With global EV sales projected to cross 30 million units by 2030, battery manufacturing equipment demand for copper foils will remain strong.

5G and IoT Expansion: The rollout of next-generation communication technologies drives PCB demand, boosting copper foil consumption.

Government Initiatives: Policies promoting clean energy, subsidies for EV purchases, and investments in renewable energy storage are directly supporting the market.

Technological Advancements: Innovations in foil thickness and high-strength grades are allowing manufacturers to meet the evolving demands of both EVs and electronics.

Regional Outlook: Asia Pacific Leads the Way

Asia Pacific dominates the global landscape, primarily due to its strong EV battery supply chain and established electronics manufacturing hubs.

China leads in both production and consumption, benefiting from its government-backed push toward EV adoption.

South Korea and Japan remain critical players due to companies like LG Energy Solution, Samsung SDI, and Panasonic, which are heavily reliant on electrodeposited copper foils.

North America and Europe are also witnessing rising adoption, driven by EV policies, the establishment of gigafactories, and increasing electronics innovation. These regions are expected to gain significant momentum in the coming years as localization of battery production accelerates.

Competitive Landscape and Industry Innovations

The Electrodeposited Copper Foils Market is highly competitive, with key players focusing on capacity expansions, product innovations, and strategic partnerships. Leading companies are investing in ultra-thin foils designed to improve energy density and reduce battery weight. Additionally, sustainable production methods are gaining attention as industries emphasize lowering carbon footprints.

Companies are also engaging in long-term contracts with EV and electronics manufacturers to secure supply chains, ensuring stability in an otherwise volatile raw materials market.

Challenges Facing the Market

Despite its strong growth potential, the industry faces challenges that require strategic responses:

High Production Costs: Manufacturing ultra-thin copper foils requires precision and advanced technology, leading to higher costs.

Raw Material Price Volatility: Copper prices are often unpredictable, affecting profitability and long-term supply planning.

Environmental Concerns: Large-scale copper mining and refining pose sustainability concerns, which the industry must address through recycling and eco-friendly practices.

A Market Poised for Innovation

The future of the Electrodeposited Copper Foils Market is closely tied to technological innovation and sustainability. With EV adoption accelerating globally and electronics becoming more sophisticated, demand for advanced foils will only rise.

Innovations such as next-generation solid-state batteries, flexible electronics, and lightweight PCBs are set to reshape industry requirements. Manufacturers that can deliver foils with enhanced conductivity, reduced thickness, and greater reliability will dominate the next phase of growth.

Fairfield Market Research notes that as the industry scales, strategic collaborations between copper foil producers and EV battery giants will become increasingly vital. This integration across the value chain ensures not just stability but also faster innovation cycles.

Electrodeposited copper foils may not always make headlines, but they are the silent force powering some of the most transformative technologies of our time. From extending EV ranges to enabling the rise of 5G and smart devices, their applications are vast and essential.

As the world pivots toward electrification and digitalization, the Electrodeposited Copper Foils Market is poised to expand significantly. With Asia Pacific leading the charge and global investments pouring into energy storage and electronics, the market will continue to play a pivotal role in shaping our technological future.

How FLIR Empowers Advanced NiTi Alloy Research at the Hong Kong Polytechnic University

FLIR X8583

Nickel-titanium (NiTi) shape memory alloys (SMAs) are unique metal alloys that can be stretched or bent when cold and hold the shape only to return to their original shape when heated. This makes NiTi SMAs useful for a wide-range of devices: surgical implants, anti-scald valves, motorized actuators, and more. Because SMAs respond to heat, researchers rely on infrared cameras to help better understand their behavior.

The Challenge: Capturing Non-Uniform Thermal Behavior in Complex Materials

NiTi SMAs are among the most promising materials for solid-state refrigeration technologies, thanks to their remarkable elastocaloric effect (eCE) and superelasticity. However, accurately characterizing their thermal behavior especially under mechanical stress remains a complex challenge.

“It is well-established that the temperature of some special shape memory alloys varies under applied stress,” explains Dr. Ruien Hu, Scientific Officer at PolyU. “We previously used thermocouples to measure temperature changes, but their single-point measurement capability was insufficient to capture the nonuniform temperature distribution across specimens particularly given the heterogeneous nature of NiTi alloys.”

The Need for Full-Field, High-Speed Thermal Imaging

To overcome these limitations, Dr. Hu and his team turned to FLIR for an appropriate science-level infraredcamera. They chose the FLIR X8583, a midwave, high-speed camera equipped with advanced lenses, filters, and software.

“Our experimental setup involves using a tensile testing machine to conduct tensile and compression tests on shape memory alloys,” says Dr. Hu.

“Simultaneously, the FLIR camera records and analyzes the temperature variations under stress. This capability is essential for understanding the elastocaloric response.”

The FLIR X8583 camera offered the high-speed, 1280 × 1024 thermal imaging the team needed to visualize inhomogeneous surface temperature distributions during mechanical loading cycles offering insights that traditional sensors could not provide.

Scientific Discovery: Microstructure-Driven Thermal Inhomogeneity

In a recent study, the team used Laser Powder Bed Fusion (LPBF) to fabricate NiTi alloys with nearequiatomic composition. They discovered significant inhomogeneity in the elastocaloric effect, with up to 4.2K temperature difference across a single sample.

“Infrared imaging revealed that the surface temperature distribution was inhomogeneous during compression-induced elastocaloric effects,” Dr. Hu notes. “This was mainly due to the non-uniform microstructure of the NiTi alloys fabricated by LPBF.”

FLIR’s thermal imaging captured striped high- and low-temperature regions, helping the team link grain size, dislocation density, and precipitate distribution to the functional performance of the material.

Testimonial: The FLIR Advantage in Research

“The high resolution of the FLIR infrared camera is particularly advantageous for our research, as our specimens are relatively small. Additionally, the camera’s exceptional frame rate allows us to capture rapid temperature changes with precision critical for our analysis. FLIR has significantly enhanced our experimental capabilities, enabling us to uncover the intrinsic thermal behavior of our specimens with greater detail and accuracy,” says Dr. Hu.

Outcome: Enhanced Understanding and Scientific Impact

With FLIR’s powerful tools, the research team was able to:

• Identify the role of microstructural inhomogeneity in temperature distribution
• Capture full-field thermal responses during cyclic mechanical testing
• Gain new insights into super elasticity and functional fatigue
• Demonstrate 96.1% recovery after the first cycle evidence of excellent super elasticity

These findings are contributing to a broader research initiative to advance solid-state cooling technologies and adaptive material design.

Support and Future Exploration

The team also credits FLIR’s technical support in their success:

“We’ve greatly benefited from the guidance of FLIR representative Mr. Liu Yongbo, who helped resolve several technical challenges. We look forward to continued collaboration and support as our research evolves.”

Dr. Hu and his team are also interested in participating in FLIR user conferences and scientific forums to share insights and foster collaboration within the research community.

FLIR Tools in Use

• FLIR X8583 Camera
• MWIR f/4 3-5 µm MTR Lens
• Research Studio Professional Edition
• Thermographic Calibration Range: -20°C to 1500°C

Conclusion: Detect the Undetectable with the FLIR X8583

By enabling fast, full-field thermal visualization, the FLIR X8583 High-Speed Infrared Camera has become an essential research tool at PolyU. It empowers scientists to explore the hidden thermal dynamics of advanced materials like NiTi alloys data that would be impossible to capture with conventional sensors.

The FLIR X8583 doesn’t just record temperature, it uncovers the science behind it. From revealing microstructural behaviors to accelerating innovation in smart materials and solid-state cooling, FLIR continues to push the boundaries of what’s possible in thermal research.

Discover More About FLIR X8583

Kodiak Taps NXP’s ISO 26262-Compliant Processors and Interfaces to Help Operate Autonomous Trucks

Autonomous Trucks

Autonomous Trucks – Kodiak Robotics, Inc. (“Kodiak”), a leading provider of AI-powered autonomous vehicle technology, and NXP Semiconductors, a trusted partner for innovative solutions in the automotive, industrial & IoT, mobile, and communications infrastructure markets, announced that Kodiak has integrated NXP’s automotive processors and in-vehicle networking interfaces to further enhance the performance, robustness, and reliability of Kodiak’s autonomous system.

NXP’s automotive solutions—the S32G3 vehicle network processor, S32K3 microcontroller, VR5510 multi-channel high-voltage power management integrated circuit (PMIC), and PF53—are integrated in the Kodiak Actuation Control Engine (ACE), Kodiak’s custom-designed computer that manages vehicle actuation independently from the main autonomy system. The ACE is designed to allow the Kodiak Driver, Kodiak’s AI-powered autonomous system, to run a safe fallback maneuver and bring a vehicle to a controlled stop if any safety-critical component of either the Kodiak Driver or the underlying vehicle platform fails.

NXP’s solutions also enable critical functions like vehicle performance monitoring. Ten times each second, the Kodiak Driver evaluates the performance of more than 1,000 safety-critical processes and components in both the self-driving stack and the underlying truck platform. Lastly, the NXP solutions power critical safety functions such as on-vehicle power management.

The addition of NXP’s automotive solutions improve the Kodiak Driver’s reliability and robustness, by supporting the system’s self-diagnostic capabilities, allowing Kodiak to improve vehicle uptime. Additionally, Kodiak believes NXP’s solutions’ broad range of vehicle interfaces  offer a flexible and cost-effective way to adapt the Kodiak Driver to additional vehicle platforms.

“Safety is the foundation of everything we do at Kodiak, and a responsibility we have taken seriously since day one,” said Don Burnette, Founder and CEO, Kodiak. “Driverless trucks require powerful and reliable safety-critical computing platforms which meet our rigorous safety standards. By incorporating NXP’s automotive solutions into the Kodiak Driver, we are positioned to incorporate the highest classification of automotive safety into our autonomous system more efficiently, and at scale.”

NXP’s high-performance computing and in-vehicle network processors selected for the Kodiak Driver are designed to support the real-time performance, subsystem integration, and functional safety requirements of Kodiak’s autonomous system. NXP’s processors deliver deterministic, real-time performance—features that we believe are critical for improvements to the Kodiak Driver’s precision control over steering, braking, throttle and power management. NXP’s solutions are compliant with the highest ISO 26262 safety integrity level, ASIL-D. ASIL-D compliance corresponds to an impressive rate of fewer than ten failures in one billion hours of operation. NXP’s solutions are helping Kodiak to further develop a scalable, safety-critical computing platform designed to support driverless trucks.

Kodiak has integrated NXP’s solutions into the computer architecture that powers the Kodiak Driver including:

  • S32G3 vehicle network processor: Kodiak integrates this high performance and high reliability processor into the ACE to enable safe actuation of vehicle controls, including redundant braking, steering, and throttle.
  • S32K3 microcontrollers for automotive applications:Kodiak uses these chips in the ACE as safety co-processors and to enable power distribution, battery charging, and safety HMI interfaces.
  • VR5510 multi-channel high-voltage PMIC: Kodiak integrates the PMIC into the ACE to provide high performance power generation, including functional safety mechanisms to monitor output voltages.
  • The PF53 ASIL D core supply regulator delivers power performance to unlock the full potential of the S32G3 core.

“Autonomous driving systems demand a level of safety and reliability that leaves no room for compromise,” said Robert Moran, GM and VP Automotive Processors at NXP. “Our ISO 26262- compliant S32 compute solutions are designed to support that level of rigor—delivering the real-time performance and functional integrity needed to help companies like Kodiak bring advanced autonomous capabilities to market with confidence.”

With NXP’s high-reliability processing at its core, Kodiak has successfully deployed the first publicly announced customer-owned and -operated driverless semi-trucks, delivering freight autonomously on real-world routes.

Gabler & Flanq Partner to Develop Submarine-Launched Uncrewed Surface Vehicles

 Uncrewed Surface Vehicles

 Uncrewed Surface Vehicles – Gabler, a leading provider of submarine systems, and FLANQ, a European innovator in autonomous maritime platforms, today announced a strategic partnership to co-develop and deliver a new class of uncrewed surface vessels (USVs) specifically designed for submarine torpedo tube launch (TTL). The announcement was made on the opening day of DALO Industry Days 2025 – the largest defence industry exhibition in Scandinavia.

This collaboration aims to deliver affordable sub-surface deployed USVs for Intelligence, Surveillance, and Reconnaissance (ISR) operations, as well as single-use tactical missions – significantly enhancing the operational flexibility of European and NATO maritime forces.

The USVs will be fully compatible with standard submarine torpedo tubes, enabling covert deployment without diver assistance. This capability provides a critical advantage for operations in denied, contested, or high-threat environments, where traditional surface or aerial naval assets may be compromised.

Both single-use and reusable USV models will be developed and produced by the two companies, incorporating sovereign suppliers and industrial partners throughout Europe. The expendable variants are designed for one-way missions, such as precision strike, while the reusable platforms will support extended ISR missions with recovery options via host platforms or surface assets.

Under the agreement, Gabler will lead system integration, commercialisation, and delivery to navies globally – building on its market leading portfolio of hoistable mast systems, submarine control technologies, and communication buoys. FLANQ will oversee design, manufacturing and payload integration – drawing on its expertise in modularity, autonomy, and scalable platform engineering.

This joint initiative directly addresses the increasing demand among European and NATO naval forces for autonomous systems capable of operating in complex and contested maritime environments. By enabling submarines to deploy low-cost, mass-produceable USVs for a wide range of missions – from littoral surveillance to deep-sea reconnaissance – this solution delivers domain advantage without compromising stealth.

“Today’s announcement on the opening day of DALO 25 reflects our shared commitment to strengthening European and allied undersea defence capabilities at pace and cost,” said Lennart Glas, Business Development Manager at Gabler. “By combining FLANQ’s strengths in autonomy, sensor payloads, and rapid manufacturing with Gabler’s six decades of expertise in high-reliability submarine systems, we are fully focussed on delivering mission-specific USVs ready for in theatre testing and evaluation at the earliest opportunity.”

“The development of these platforms comes at a pivotal time for European and allied naval forces,” said Daniel Esser, Chief Commercial Officer and Co-Founder at FLANQ. “Our rapidly produced USVs with their Commercial-Off-The-Shelf (COTS) payloads from sovereign partners – paired with Gabler’s know-how in submarine engineering and operations – will help deliver persistent ISR and tactical reach at scale, speed and value.”

About Gabler

 Gabler, based in Lübeck, Germany, is a leading supplier of mast and hoist systems, communication buoys and control systems for submarines and autonomous underwater vehicles, including XLAUVs worldwide. With decades of experience and a portfolio spanning both conventional and advanced naval programs, Gabler supports the global submarine community with innovative, mission-critical technologies designed for the future of undersea warfare.

About FLANQ

Headquartered in Rostock, Germany, FLANQ delivers integrated maritime defence solutions across Europe, with a focus on mission-configurable autonomous surface platforms, sensor fusion, and rapidly-deployed critical infrastructure security systems.

Telit Cinterion Boosts deviceWISE AI Visual Inspection with NVIDIA TAO 6.0

deviceWISE AI Visual Inspection Enhanced with NVIDIA TAO 6.0

Telit Cinterion, an end-to-end IoT solutions enabler, announces the latest enhancement to its deviceWISE AI Visual Inspection platform through integration with NVIDIA TAO 6.0. This integration brings low-code AI capabilities to industrial visual inspection, allowing manufacturers to leverage prompt-based segmentation, in-context annotations, and powerful foundation models for tasks such as object pose estimation. Now, quality control teams, engineers and production managers can develop and deploy custom AI models more rapidly, identifying defects and optimizing processes with greater precision across factories. For more information about deviceWISE AI Visual Inspection with NVIDIA TAO, visit https://www.telit.com/devicewise-ai-consultation/.

Launched in August 2023, deviceWISE AI Visual Inspection delivers a turnkey solution that enables manufacturers in automotive, pharmaceutical, healthcare, energy and other industries to and analyze visual data from their production environments. By uncovering early signs of quality control issues — whether at employee workstations, industrial robots, CNC machines, or other equipment — the platform helps teams take immediate corrective action. This proactive approach reduces rework and unplanned downtime, while boosting product quality, operational efficiency, and on-time delivery across manufacturing lines.

The integration with NVIDIA TAO 6.0 builds on this foundation by incorporating advanced annotation tools, such as prompt segmentation and in-context segmentations, which enable auto-labeling of object detection and segmentation masks using simple text prompts — like “missing bolt on assembly line” or “coating variation on component” — without the need for extensive training or fine-tuning. This reduces annotation costs and effort while improving accuracy for specific industrial objects. Because TAO ships containerized micro‑services with pre‑trained foundation models, it integrates into the existing deviceWISE Visual Inspection pipeline with minimal changes.

Additionally, the integration utilizes foundation models, including FoundationPose for estimating object poses, alongside other models like NV-DINOv2, NV-CLIP, and GroundingDINO. These pretrained models, fine-tuned with minimal custom data via transfer learning, support multi-modal and deliver high-performance inferencing. Deployable on a range of platforms from GPUs to edge devices, NVIDIA TAO 6.0 ensures seamless on-premises operation, maintaining robust security for proprietary data without cloud dependencies.

“Integrating NVIDIA TAO 6.0 into deviceWISE AI Visual Inspection empowers manufacturers to build and deploy custom AI models with unparalleled ease and speed,” said Linir Zamir, Team Lead, deviceWISE AI Development at Telit Cinterion. “deviceWISE Visual Inspection enables manufacturers to collect, transform and integrate data from any machine to any IT system, creating full applications for Industry 4.0 and digital transformation. With TAO’s low‑code auto‑labeling, pose‑estimation and multi‑modal models built in, customers get faster deployment, higher accuracy and zero custom code or specialty cameras.”

A7663E Achieves Key Global Certifications, Enabling Scalable 4G IoT Deployments

4G IoT

4G IoT Deployments – As the global demand for LTE Cat 1 modules continues to rise in industrial IoT, asset tracking, and metering applications, SIMCom (as a global leader in IoT communication and solution)’s A7663E stands out with a balanced mix of performance, integration flexibility, and certification readiness. The module has recently secured a comprehensive set of international certifications, including RoHS, REACH, CE (RED) for the European market, Anatel for Brazil, and Cybersecurity compliance, paving the way for faster IoT deployment in regulated global markets.

The A7663E is built LGA form factor, offering high integration capability while maintaining reliability. It supports LTE-FDD with downlink speeds up to 10 Mbps and uplink up to 5 Mbps, making it suitable for medium-data-rate IoT scenarios that demand efficient wireless performance and long lifecycle support. The inclusion of integrated multi-constellation GNSS (GPS, GLONASS, BeiDou) further enhances its value for location-based applications like asset tracking, smart mobility, telematics, surveillance devices, industrial routers, and remote diagnostics and so on.

Additionally, A7663E provides a rich set of interfaces to support diverse product architectures. Its software feature set includes FOTA (Firmware Over-The-Air), SSL encryption, and LBS—ensuring devices stay secure and up-to-date throughout their lifecycle. This greatly reduces time-to-market and engineering cost.

With global compatibility, the A7663E is an ideal LTE Cat 1 solution for IoT developers aiming to scale deployments across multiple regions with confidence.

For more information visit: https://www.simcom.com

AstroAgency Expansion Continues with New Partnerships and U.S. Showcase

AstroAgency

A strategic communications and market intelligence firm dedicated to the commercial space industry is accelerating its expansion into North America, formalising two new transatlantic partnerships. UK-headquartered AstroAgency has signed two Memorandums of Understanding (MOU) with Voyager Technologies and Cislunar International, kicking off a six-month push to grow the firm’s connections and clients across the United States and Canada.

The first MOU will see AstroAgency and Voyager Technologies collaborate across several fronts, including European and U.S. stakeholder engagement, strategic marketing support, and the development of VISTA, a new science park initiative. AstroAgency is anticipated to establish a North American office at VISTA as the development progresses.

“AstroAgency’s establishment at VISTA is a reflection of our shared belief that in-space research starts with collaboration here on Earth,” said Jeffrey Manber, president, International & Space Stations, Voyager Technologies. “Our science park lays the foundation for a truly international ecosystem, one that accelerates discovery, fosters innovation and ensures space can benefit all of humanity.”A second MOU was signed with Cislunar International, a growing company with bases in Washington and Texas, focused on tailored support for aerospace businesses. The agreement builds on a long-standing relationship with Cislunar co-founder Sam Peterson, who has served as an advisor to AstroAgency since 2023. The partnership will see both firms work together to strengthen services for their international client bases.

The new partnerships followed AstroAgency’s participation in last week’s Small Satellite Conference in Salt Lake City, Utah, where company Director Daria Filichkina featured on stage in a panel discussion alongside representatives from the United States National Oceanic and Atmospheric Administration (NOAA), Astroscale and the Secure World Foundation.

“We’re excited to deepen our North American partnerships and bring our experience in delivering bold, impactful campaigns and strategic guidance to companies across the United States and Canada,” said Daniel Smith, CEO of AstroAgency. “After six years of pioneering this niche service, backed by more than 100 project case studies, SmallSat offered the perfect launchpad for our next chapter.”

AstroAgency’s trip to Utah part of a space delegation led by Scottish Development International, while the Voyager signing in Colorado was attended by representatives of the UK Department for Business and Trade. The activity reflects the company’s continued focus on international collaboration, sustainability in space and stakeholder engagement; values demonstrated through AstroAgency’s collaborations with the UK Space Agency, European Space Agency, Committee on Earth Observation Satellites, United Nations, Mohammed bin Rashid Space Centre, and the Australian and Scottish Governments.

Established as the first full-service marketing agency for space in 2019, the company previously delivered projects in North America for clients that include NovaSpace, PCI Geomatics, the Secure World Foundation, Asterra, TerraMetric and, more recently, the firm secured its first collaboration with NASA. Last week’s developments reflect a strategic commitment to the region as a priority for long-term growth, with Canadian talent already among the company’s expanding international team. New resources and senior leadership focus are being invested to strengthen relationships and increase AstroAgency’s presence locally. To date, the firm has supported over 80 organisations worldwide, from government space agencies to commercial satellite manufacturers, launch providers, and Earth observation companies, with clients including Spire Global, CATALYST, and Hydrosat. Most recently, AstroAgency welcomed its first Japanese client, Axelspace, following a successful trade mission to Japan.

With the United States the most mature space economy in the world and Canada’s sector growing at pace, AstroAgency sees this North American expansion as a natural step in its global mission in transforming how people understand space; not as a distant ambition, but as a vital enabler of economic growth, environmental resilience and daily life on Earth.


Military Tactical 5G Network Market to Hit $10.8 Billion by 2033

Military Tactical 5G Network Market

Market Summary

According to latest research by Research Intelo, the Global Military Tactical 5G Network market size was valued at $2.3 billion in 2024 and is projected to reach $10.8 billion by 2033, expanding at a robust CAGR of 18.6% during the forecast period 2025–2033. The surge in demand for real-time data transmission, secure communications, and high-speed connectivity on the battlefield is a primary factor fueling the growth of the military tactical 5G network market globally. As modern warfare increasingly relies on advanced digital infrastructure, the integration of 5G technologies into military operations is transforming command and control, intelligence, surveillance and reconnaissance (ISR), and electronic warfare capabilities, enabling enhanced situational awareness and faster decision-making for defense forces worldwide.

The Military Tactical 5G Network Market driven by the increasing adoption of advanced communication systems in defense operations. Military tactical 5G networks are specialized communication infrastructures designed for defense applications. They integrate high-speed wireless connectivity with low latency, enabling real-time data exchange among troops, vehicles, drones, and command centers. These networks support intelligence, surveillance, and reconnaissance (ISR) operations while ensuring network resilience in hostile environments.

Key Market Drivers

One of the primary growth drivers is the need for real-time battlefield intelligence. Modern military operations rely on rapid data processing and secure communication, which traditional networks often fail to deliver. The rise of unmanned systems, autonomous vehicles, and AI-powered defense technologies further underscores the importance of 5G-enabled tactical networks.

Additionally, geopolitical tensions and increasing defense budgets in countries like the US, China, and European nations are accelerating the deployment of advanced communication systems. Governments are investing heavily in resilient networks capable of functioning in high-risk environments.

Challenges

Despite its promising growth, the market faces several challenges. High deployment costs and the need for specialized infrastructure make large-scale implementation expensive. Cybersecurity threats remain a critical concern, as sophisticated attacks could compromise sensitive military operations. Additionally, spectrum allocation and interoperability issues between legacy systems and 5G networks can hinder seamless integration. Harsh battlefield environments also demand robust, resilient hardware capable of functioning under extreme conditions.

Opportunities

The market presents significant opportunities for innovation and expansion. Integration with AI and autonomous systems can enhance decision-making and operational efficiency. The development of satellite-enabled 5G networks opens possibilities for global connectivity in remote and contested areas. Increasing government defense budgets and modernization programs provide a steady stream of contracts for technology providers. Furthermore, partnerships between telecom companies and defense agencies can accelerate the deployment of next-generation networks, driving both technological advancement and market growth.

Technological Advancements

Recent innovations are shaping the tactical 5G market. Edge computing and network slicing allow militaries to allocate bandwidth efficiently, ensuring uninterrupted communication for critical missions. Advanced encryption protocols and cybersecurity solutions are also being integrated to protect sensitive information from cyber threats.

Moreover, the use of satellite-based 5G solutions is emerging as a complementary technology, offering connectivity in remote and contested regions. These technological advancements are pivotal in enhancing operational efficiency and reducing response times during combat operations.

Competitive Landscape

  • Ericsson
  • Huawei Technologies
  • Nokia Corporation
  • Samsung Electronics
  • Lockheed Martin
  • Raytheon Technologies
  • Northrop Grumman
  • BAE Systems
  • Thales Group
  • L3Harris Technologies

Future Outlook

The military tactical 5G network market is expected to witness robust growth over the next decade. Collaboration between defense agencies and technology providers is likely to drive innovation in network architecture, AI integration, and cybersecurity. As global militaries modernize their communication infrastructure, 5G networks will become central to strategic operations.

Source: https://researchintelo.com/report/military-tactical-5g-network-market