Saturday, October 25, 2025
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Proudly Made in India: Fibocom & Kaynes Technology Join Forces to Drive IoT Innovation, Policy Compliance, and Local Growth

Fibocom & Kaynes Technology

Fibocom & Kaynes Technology – Fibocom,a leading global provider of wireless communication modules and AI solutions,today announced a strategic manufacturing partnership with Kaynes Technology, oneof India’s foremost electronics and semiconductor manufacturing pioneers. Thiscollaboration underscores Fibocom’s commitment to India’s national initiatives,including Make in India and Atmanirbhar Bharat,while addressing the growing demand for locally produced IoT components.

Equipped withhigh-speed SMT lines, automated testing systems, and precision assemblyequipment, the state-of-the-art facility in Karnataka, Hyderabad, and Gujaratstrengthens Fibocom’s integration into India’s dynamic manufacturing ecosystem.This initiative represents more than capacity expansion — it reflects Fibocom’svision to embrace India, grow with India, and empower the world through India.

Strategic PolicyAlignment and Market Commitment

Fibocom’sinvestment in local manufacturing is fully aligned with India’s industrial developmentagenda, supporting technological self-reliance, accelerating time-to-market forIndian OEMs, and delivering long-term value to both domestic and globalcustomers.

Partnering with India’s ManufacturingLeader

With decades ofexpertise in precision manufacturing, supply chain integration, and world-classquality systems, Kaynes Technology provides the foundation for this strategicpartnership. Together, Fibocom and Kaynes Technology are advancing India as aglobal force for next-generation connectivity solutions.

“Kaynes Technologyis proud to join forces with Fibocom to deliver critical IoT componentsmanufactured in India,” said Raghu Panicker, CEO, Kaynes Technology.“This collaboration enables local industries to innovate faster, scale smarter,and compete more effectively on the global stage.”

Trusted & Proudly Made in India

Fibocom’s locallyproduced modules are designed to global standards while proudly bearing the’Made in India’ mark. This not only enhances trust among Indian OEMs andgovernment stakeholders but also reinforces India’s growing reputation as areliable center for IoT innovation and exports.

“Thispartnership is a statement of intent — Fibocom is here not just to sell, but tobuild, invest, and grow with India,” said Ragin Kallanmar Thodikai, Country SalesManager, India, Fibocom“We are proud to contribute to afuture where intelligent connectivity is Madein India and trusted worldwide.

Voyis Support Launch: Professional Services for Underwater Visual Surveys & Photogrammetry

Voyis Support Launch

Voyis Support Launch – Voyis is proud to announce the launch of Voyis Support, a new professional service designed to help clients achieve successful underwater visual surveys and photogrammetry projects. Building on over a decade of expertise in subsea imaging and 3D reconstruction, Voyis Support provides the technical guidance, operational experience, and advanced methodologies needed to deliver accurate results from survey planning consultation through to final 3D models.

Whether you are an asset owner looking to outsource a complete underwater inspection, or a survey company deploying Voyis technology independently, Voyis Support ensures reliable results, efficient mobilization, and high-quality data, every time.

Expertise That Translates Into Results

With more than ten years of experience in underwater vision and photogrammetry, the Voyis team brings unrivaled knowledge to every project. This expertise goes beyond technical proficiency, it directly translates into smoother operations, reduced downtime, and minimized rework. By combining cutting-edge technology with real-world operational insight, Voyis ensures surveys are executed efficiently, helping clients save valuable time and resources while maintaining complete confidence in data quality.

Comprehensive Services for Every Stage of the Survey

Voyis Support is designed to be scalable and flexible, ensuring clients can access the level of support that best suits their needs. Services range from targeted consultations to onsite technician support and generation of data deliverables.

  • Project Consultation: Expert guidance on survey design, mobilization planning, and best practices to align projects with specific goals.
  • Onsite or Remote Acquisition Support: Professional assistance to ensure smooth operations, data integrity, and troubleshooting in real time.
  • Data Processing & Photogrammetry: Transformation of image datasets into clean, accurate, and ready-to-use 3D models for engineering, analysis, or visualization.

Through each of these services, Voyis emphasizes data quality assurance, reducing costly rework and ensuring survey efficiency.

Delivering High-Quality 3D Results

From the earliest planning stages to the final deliverables, Voyis Support is focused on turning stills data into precise and actionable outputs. Clients can expect:

  • Clear, tailored survey plans aligned with project goals
  • Confident execution supported by expert technicians
  • Verified data integrity through rigorous quality control
  • Accurate 3D photogrammetry models ready for immediate application

Why Choose Voyis Support?

By partnering with Voyis, customers can fill capability gaps without long-term resourcing, reduce operational risks and costs, and benefit from advanced photogrammetry workflows. The program is designed to scale with the needs of each project, whether for a single consultation, short-term field support, or development of data deliverables.

With Voyis Support, clients gain confidence that every survey will deliver reliable, high-quality results, unlocking the full potential of their underwater visual data.

Learn more about Voyis Support and how it can enhance your next underwater survey project: https://voyis.com/services-voyis-support/

SPH Engineering Launches Multibeam
Echosounder (MBES) payload for UAV

Payload for UAV

Payload for UAV – SPH Engineering has announced the release of the MBES system for UAV (unmanned aerial vehicles) utilizing Cerulean Surveyor 240-16, a compact multibeam echosounder (MBES). Available immediately, the payload expands the capabilities of drone-based bathymetric and hydrographic surveys by delivering dense, high-resolution bathymetric data over shallow waters.

The Surveyor 240-16 operates at 240 kHz with a measurement range of 0.5–50 m, making it suitable for inland waterways, reservoirs, ports, and environmental monitoring sites. Unlike traditional single-beam payloads, the MBES generates a swath up to 80° cross-track, with a 16-element receive array and angular resolution down to , enabling operators to map a wide bottom coverage per flight line.

Integration with UAV Workflows

The new payload is designed to work seamlessly with SPH Engineering’s UgCS flight planning software and SkyHub onboard computer, allowing extremely precise and automated missions. With a total weight of 2.4 kg (all components in air) and a power consumption of only 15 W, the Surveyor 240-16 is compatible with UAVs such as DJI M300/M350/M400 and Inspired Flight IF800/IF1200.

Field Validation at Titutga Lake

In August 2025, SPH Engineering conducted a measurement campaign at Titutga Lake (Latvia) using the MBES payload. Flights were performed at an average survey speed of 1.2 m/s, a benchmark found to balance data density with UAV endurance. The MBES provided a step-change in efficiency by capturing high resolution bottom details.

The system’s performance was also benchmarked against single-beam payloads, which remain valuable as QC tools for MBES datasets. The combined approach demonstrated how drone-based hydrography can achieve both high-resolution mapping and robust validation in environments previously inaccessible or unsafe for boat-based systems.

Technical Differentiators

  • Frequency: 240 kHz
  • Measurement Range: 0.5 – 50 m
  • Beam Geometry: 4° along-track TX; 7° cross-track RX (conventional beamforming)
  • Angular Resolution: 1° (angle-of-arrival processing)
  • Range Resolution: 0.5% of range setting
  • Power Consumption: 15 W
  • Integrated Sensors: Tilt/roll, temperature
  • Weight: 1.8 kg (sensor and mounting only), 2.4 kg (all components)
  • Software Compatibility: Fully supported in BeamworX, with Hydromagic integration planned

Expert Commentary

“The payload based on Cerulean Surveyor 240-16 represents a milestone in drone-based bathymetry,” said Alexey Dobrovolskiy, CEO of SPH Engineering. “By combining multibeam technology with UAV platforms, we are enabling hydrographers to collect dense bathymetric datasets at a fraction of the time and cost of conventional systems. This integration opens new opportunities for surveying reservoirs, lakes, and coastal areas that were previously inaccessible or unsafe.”



SIM8260 series Achieves Global Certifications, Delivering High-Performance 5G Connectivity

5G Connectivity

5G Connectivity – SIMCom, a global leader in IoT communication and solutions, proudly announces that its SIM8260 Series 5G modules have successfully obtained a wide range of international certifications, including CE, RCM, FCC, IC, JATE, TELEC, GCF, PTCRB, T-Mobile, Verizon, Deutsche Telekom, Orange, RoHS, REACH. These certifications demonstrate the SIM8230 series’ compliance with global standards and network requirements, ensuring smooth deployment across worldwide markets.

Built on the Qualcomm® Snapdragon™ X62 chipset platform, the SIM8260 series are a multi-band 5G Release 16 module supporting NR, LTE-FDD, LTE-TDD, and HSPA+ in both NSA and SA modes. With its advanced capabilities, the SIM8260 series enable fast, stable, and secure mobile broadband connections for a wide range of industrial and commercial applications.

The SIM8260 series achieve outstanding data rates across multiple network environments. On 5G Sub-6G SA, it supports download speeds of up to 2.4Gbps and upload speeds of up to 1Gbps, while in 5G Sub-6G NSA mode it can reach 3.4Gbps (DL) and 600Mbps (UL). For LTE networks, peak speeds of 1.6Gbps downlink and 200Mbps uplink are supported, and on HSPA+, the module achieves 42Mbps (DL) and 5.76Mbps (UL). These capabilities ensure stable, high-capacity communication to meet the demands of data-intensive IoT and enterprise applications.

Beyond performance, the SIM8260 series offer robust expansion capabilities with a wide range of interfaces including PCIe, USB 3.1, and GPIO, enabling flexible integration into customer solutions, reduce development costs, and accelerate time-to-market.

With its combination of high throughput, flexible integration, and proven security, the SIM8260 series are ideally suited for use cases such as smart manufacturing, connected vehicles, customer premises equipment (CPE), robotics, and other next-generation IoT solutions.

The achievement of comprehensive global certifications underscores the SIM8260 series’ in large-scale international deployment. These approvals not only confirm compliance with stringent regulatory, safety, and environmental standards, but also guarantee broad operator interoperability across regions. For customers, this means accelerated product launches, reduced deployment risks, and greater confidence in global scalability.

Commercial UAV Expo Returns to Las Vegas, Sept. 2-4, During FAA BVLOS Comment Period

Commercial UAV Expo

More than 3,500 commercial drone professionals from over 70 countries will gather at Commercial UAV Expo, the world’s leading commercial drone trade show and conference, to connect, collaborate, and explore the newest developments in drone technology, applications, and operations. The event takes place at Caesars Forum in Las Vegas from September 2-4, 2025.

“Commercial UAV Expo continues to be the place where the industry comes together, and this year the conversations carry even greater weight as it is the first major industry gathering since the FAA released its long-awaited Part 108 BVLOS NPRM,” said Lee Corkhill, Group Event Director, Commercial UAV Expo. “With the proposed rule currently in the 60-day public comment period, the timing of Commercial UAV Expo gives professionals a unique opportunity to learn what Part 108 means for their operations, ask questions directly, and engage in critical dialogue that will help shape the future of the drone industry.”

The Conference Program will feature 140+ speakers delivering practical, actionable education with a strong focus on regulatory updates, BVLOS operations, autonomy, AI, and real-world case studies. Attendees can also take advantage of UAV role-based itineraries designed to maximize value for specific job functions, including:

  • Airspace Management Itinerary
  • Drone Pilot Itinerary
  • Project Manager Itinerary
  • Public Safety Itinerary
  • Service Provider Itinerary
  • Surveyor Itinerary

Special features at Commercial UAV Expo 2025 include:

Indoor Airspace: A new dedicated demonstration zone on the exhibit hall floor where attendees can experience UAV hardware and software in action.
Pilot Hub: A gathering place for drone pilots at all levels to gain insights into operations, training, and business expansion, plus resources to build successful careers.
DRONERESPONDERS Public Safety Summit: A two-day program delivering best practices, case studies, and practical insights for public safety UAS professionals.
Pilot Institute Workshops and Courses: Deep-dive training opportunities including the Cutting Edge Industry Insights: Essentials for Every Drone Pilot workshop, as well as courses that begin with online training and culminate with a live module delivered onsite at the event, designed to help operators grow their businesses and technical expertise.
Level Up Lounge: A dedicated space for professional and brand development, offering 15-minute consultations and resources to strengthen personal and organizational impact.

Keynotes will feature high-level speakers from across industry and government, including former FAA leadership, leading UAV vendors, and enterprise users who will address the regulatory landscape, adoption of autonomy and AI, and strategies for scaling commercial drone programs.

The Exhibit Hall will feature more than 225 exhibitors showcasing cutting-edge solutions from leading vendors, while additional programming on the Summit Stage will spotlight new products, case studies, and interactive discussions. More than 300 associations and media organizations have signed on as event supporters, underscoring Commercial UAV Expo’s position as the premier event for anyone integrating and operating commercial UAS.

Additional event features include Exhibitor Showcases, Roundtables, Welcome Reception, Networking Happy Hour, Pitch the Press, and more—making Commercial UAV Expo the must-attend annual gathering for the global drone community.

Registration is still open—secure your spot today at www.expouav.com.

u-blox NORA-B2 Bluetooth 5.4 LE Modules, Now at Mouser Electronics, Support Ultra-Low Power IoT Applications

u-blox NORA-B2 Bluetooth 5.4 LE Modules

u-blox NORA-B2 Bluetooth 5.4 LE Modules Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the NORA-B2 stand-alone Bluetooth® 5.4 LE modules from u-blox.

u-blox NORA-B2 modules feature ultra-low power and are based on the nRF54 system-on-chip (SoC) from Nordic Semiconductor. These power-efficient modules support Bluetooth LE 5.4, Zigbee, and Thread/Matter technologies in a compact and secure format. The modules provide IoT devices with the processing power for edge computing and machine learning without additional components. The NORA-B2 series consumes up to 50% less current compared to previous generations of Bluetooth LE modules, resulting in smaller batteries or longer battery life in end products.

These modules are ideal for Internet of Things (IoT) applications such as industrial automation, healthcare, smart homes, and asset tracking tags.

To learn more, visit https://www.mouser.com/new/u-blox/u-blox-nora-b2-bluetooth-le-modules/.

As a global authorised distributor, Mouser offers the world’s widest selection of the newest semiconductors and electronic components — in stock and ready to ship. Mouser’s customers can expect 100% certified, genuine products that are fully traceable from each of its manufacturer partners. To help speed up the design process for customers, Mouser’s website hosts an extensive library of technical resources, including a Technical Resource Centre, along with product data sheets, supplier-specific reference designs, application notes, technical design information, engineering tools and other helpful information.

Telit Cinterion Enables 5G Connectivity for NVIDIA Jetson Thor to Accelerate the Future of Mobile AI Robotics

Telit Cinterion Unveils deviceWISE® AI

Telit Cinterion Enables 5G Connectivity for NVIDIA – Telit Cinterion, an end-to-end IoT solutions enabler, announces that its portfolio of 5G modules — including RedCap modules like the FE920C04 — is concluding validation testing with the newly launched NVIDIA Jetson Thor platform. This integration will extend Telit Cinterion’s support for the NVIDIA Jetson ecosystem, enabling high-performance connectivity for next-generation autonomous machines and mobile AI systems. For information on obtaining and using Telit Cinterion 5G cellular modules and data cards for use with the NVIDIA Jetson Thor platform go to: https://www.telit.com/telit-nvidia-jetson-platform/

Jetson Thor is NVIDIA’s highest performing edge AI platform to date, designed to support complex robotics applications including humanoid robots, autonomous delivery systems, and intelligent industrial automation. Telit Cinterion’s 5G modules are engineered to provide the ultra-reliable, low-latency connectivity required for these systems to operate safely and efficiently in dynamic environments.

“5G is a foundational capability for humanoid and mobile AI robotic devices,” said Manish Watwani, President of IoT Products at Telit Cinterion. “With Jetson Thor, NVIDIA is unlocking new levels of compute for autonomous systems and Telit Cinterion is proud to deliver the connectivity that makes cloud integration possible.”

Telit Cinterion’s 5G portfolio includes modules designed for bandwidth-intensive applications, offering global coverage, LTE fallback, and advanced features like GNSS support, VoNR, and embedded processing. These modules are purpose-built for industrial gateways, robotics, healthcare, and security systems — making them ideal for the intelligent edge.

Quectel launches 5G antennas to maximize developer choice and enhance device performance

Quectel launches 5G antennas – Quectel Wireless Solutions, a global IoT solutions provider, has expanded its comprehensive antenna portfolio with the launch of two new 5G antennas, the YECT004W5AM and YECT005WFA.

The YECT004W5AM is a 5G external antenna is a terminal mount external dipole antenna measuring 140mm × 15.6mm × 13mm. The antenna delivers reliable 5G connectivity while supporting 2G, 3G, and 4G networks, and comes equipped with a Fakra female Code Z connector for secure and versatile integration. Ideal for applications where the antenna is required to be discreet, this low profile, terminal mount omnidirectional antenna is easy to install and offers maximized durability thanks to its IP67-rated blended polycarbonate (PC) and acrylonitrile butadiene styrene (ABS) enclosure. The antenna is both REACH and RoHS compliant.

The YECT005WFA 5G exterior antenna is a terminal mount whip dipole antenna offering 5G coverage as well as backward-compatibility to support previous generations of cellular connectivity. The antenna has dimensions of 135mm x 15.6mm x 13mm, weighs approximately 16g and operates in the -40°C to +85°C temperature range. The antenna is terminated with a reverse polarity sub-miniature version RP SMA male connector which makes the YECT005WFA suitable for use cases that require the antenna to be discreetly positioned. This antenna also features a PC and ABS enclosure that can withstand harsh weather conditions and handle high and low temperatures.

Both 5G antennas operate in the ultra-wide 600-6000MHz frequency band to bring 5G connectivity to a wide range of use cases. The antennas are ideally suited for applications in gateways and routers, smart meters, vending machines, industrial IoT, smart homes and connected enterprises. The operating efficiency that the antennas offer mean they can support power and space-constrained devices in these sectors while also supporting low latency, high-speed 5G coverage.

Incorporating hinged RP SMA male connectors helps deployed devices to achieve the optimum position. The hinged structure adopted by the YECT005WFA and the YECT004W5AM further assists in avoiding signal interference from other antennas or obstructions from objects by enabling rotation to different directions when mounted on the terminal.

“We’re delighted to be able to bring the YECT005WFA and YECT004W5AM 5G antennas to the market,” says David Wei, Senior Product Director, Antenna Product Dept, Quectel Wireless Solutions. “These external, surface-mount antennas bring 5G connectivity to a wide range of devices for the first time and are ready to enable a new generation of 5G devices. In addition, Quectel’s comprehensive range of antenna engineering and development services can be accessed by customers to ensure optimized performance and deployment.”

In addition to supplying antennas, Quectel also offers comprehensive antenna design support which includes simulation, testing and manufacturing for customized antenna solutions. These can be custom designed to ensure the antenna deployment scenario aligns precisely with the developers’ specific application requirements. Quectel’s regional R&D centers, coupled with its global network of antenna experts, are ready to help meet the requirements of device designers, developers and deployment specialists as they roll-out 5G-capable antennas to their customers.

For more information, please visit: www.quectel.com 

Kodiak Appoints Surajit Datta as Chief Financial Officer

Kodiak Appoints Surajit Datta as Chief Financial Officer

Kodiak Appoints Surajit Datta as Chief Financial OfficerKodiak Robotics, Inc. (“Kodiak”), a leading provider of AI-powered autonomous vehicle technology, today announced that Surajit Datta has joined the company as Chief Financial Officer, effective immediately. Mr. Datta will be part of Kodiak’s executive leadership team and oversee all aspects of Kodiak’s financial operations, including Financial Planning & Analysis (FP&A), accounting, tax and treasury, investor relations, and internal audit. Mr. Datta succeeds Eric Chow, who has been with Kodiak since January 2019, has served as CFO since 2022 and plans to remain at Kodiak through the end of 2025 to support the transition.

Mr. Datta will draw on his deep experience in financial operations and leadership at publicly traded artificial intelligence (“AI”), semiconductor, and SaaS companies, as well as at top-tier investment banks, to support Kodiak’s next chapter of growth. He joins Kodiak as the company prepares to become a publicly listed company via a business combination with Ares Acquisition Corporation II (NYSE: AACT). Through this business combination, Kodiak expects to become publicly listed on NASDAQ in the second half of 2025.

As a seasoned corporate finance professional, Mr. Datta brings more than 20 years of experience in strategic finance, financial planning and analysis, business partnering, corporate development and strategy, capital raising, and investment banking. He has a proven track record of helping scale private and public companies across industries.

Most recently, Mr. Datta served as Vice President of Finance at SentinelOne, a publicly traded AI-powered cybersecurity firm. Prior to SentinelOne, he held several senior-level positions with semiconductor and AI technology company Arm, including serving as Vice President of Finance and Corporate Development. In addition, Mr. Datta has over a decade of experience in investment banking at Evercore and J.P. Morgan, where he led the origination and execution of complex advisory, debt and equity transactions.

Mr. Datta received an MBA from the University of Chicago Booth School of Business, a Post Graduate Degree in Management from the Indian Institute of Management, Calcutta, and a B.Tech from the Indian Institute of Technology, Kharagpur.

“Surajit brings significant strategic and operational finance leadership expertise to Kodiak, which will be invaluable to us as we expect to enter the public markets and continue to execute on our strategy to scale our business,” said Don Burnette, Founder and CEO, Kodiak. “We believe a leader of Surajit’s caliber and insight, including his over two decades of experience at leading financial institutions and with rapidly-growing AI technology companies, will strengthen our C-suite and help accelerate our sustainable growth. I would also like to thank Eric for his leadership and dedicated and loyal service helping build Kodiak to where we are today. We appreciate his continued support and wish him the very best in his next chapter.”

“I am excited to join Kodiak because I believe the company’s leadership, technology, and track record sets it apart in the autonomous vehicle industry,” said Mr. Datta. “It’s a compelling time for Kodiak as the company embarks on the next phase of growth. Kodiak has demonstrated that it is well-positioned to deliver autonomous technology at scale, and I believe that we have a tremendous opportunity ahead.”

For more information about Kodiak, please visit https://kodiak.ai.

Ansys Announces Agreement to Offer Access to NVIDIA Omniverse Technology from within Simulation Solutions

NVIDIA Omniverse

Key Highlights

  • Ansys integrates NVIDIA Omniverse capabilities directly into its products, starting with autonomy and computational fluid dynamics (CFD) solutions, delivering simplified data preparation, interoperability, and access to the Omniverse ecosystem
  • The agreement accelerates physical AI development, enhances digital twin capabilities, and delivers immersive visualizations in a virtual environment, accelerating innovation across industries

Ansys, part of Synopsys (NASDAQ: SNPS) and NVIDIA signed an agreement to license, sell, and support Omniverse technology embedded in Ansys simulation solutions. Through its integration of NVIDIA Omniverse, Ansys will deliver easy access to Omniverse technologies and libraries to customers, starting with its CFD and autonomous solutions. From deepening insights into aerodynamics to advancing autonomous vehicle safety and 6G connectivity, this collaboration fuels progress that empowers transformative solutions.

Ansys technology utilizes Universal Scene Description (OpenUSD) to integrate seamlessly with Omniverse technologies, enabling accessible, smooth workflows across diverse simulation applications. By leveraging Omniverse platform capabilities directly from the Ansys interface, teams are empowered to innovate faster, tackle challenges head-on, and achieve research breakthroughs.

The agreement ensures seamless interoperability between diverse computer-aided engineering (CAE) tools, enabling a unified and efficient workflow — critical to large CFD applications. Visualizing fluid dynamics in physically based digital environments enables engineers to analyze complex datasets more intuitively, resulting in smarter, faster design optimization for even the most challenging engineering tasks.

In addition, the integration empowers engineers with high-fidelity outputs, making it easier to develop, train, test, and validate autonomous systems with greater speed and confidence. By automating scenario generation and exploration, it ensures these autonomous systems are continuously validated for safety, precision, efficiency, and reliability.

“Product development processes are only getting more complex, so modern teams need a virtual environment that allows them to simulate, visualize, iterate, and collaborate,” said Walt Hearn, senior vice president of worldwide sales and customer excellence at Synopsys. “By integrating advanced Omniverse technologies and libraries, our customers drive innovation in simulation-led workflows, empowering teams to achieve greater efficiency, performance, and scalability.”

Moreover, PyAnsys, a family of Python packages, enables users to customize and automate simulations within their own applications built on NVIDIA Omniverse. One illustrative example highlighting this joint work with NVIDIA is PyAnsys-Heart, a digital twin of the human heart that unlocks transformative simulation insights through an intuitive speech-to-text interface requiring minimal engineering expertise.

“To address the complexity of modern engineering challenges, industries require precise physical AI models, highly accurate digital twins, accessible high-resolution simulation tools, and physics-accurate virtual environments to solve real-world problems and enable reliable performance predictions,” said Rev Lebaredian, vice president of Omniverse and simulation at NVIDIA. “Combining the predictive power of Ansys solvers with NVIDIA simulation technologies and libraries is a turning point for industries striving to simulate reality with precision.”